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Title:
DIVIDING DEVICE AND DIVIDING METHOD
Document Type and Number:
Japanese Patent JP2007161522
Kind Code:
A
Abstract:

To provide a dividing device and a dividing method, which suppress the occurence of thermal damage, which can divide an object with a simple structure and which have high productivity.

Laser beams from a laser device 13 are condensed on the surface of a glass substrate 12 by a lens 15 consisting of a bi-focus lens and form first spot light 25 and second spot light 26 on the surface of the glass substrate 12. A softening area 27 irradiated with the second spot light 26 is heated to a temperature higher than the softening temperature Ts of the glass substrate 12. A heating area 28 which is an area irradiated with the first spot light 25 except the softening area 27 is heated to a temperature lower than the softening temperature Ts. The heating area 28 and the softening area 27 are relatively moved to the glass substrate 12 along a dividing scheduled line 22 by moving the glass substrate 12 to another direction of a first direction X and then the glass substrate 12 is divided along the dividing scheduled line 22.


Inventors:
Kokubo, Fumio
Sakai, Keiji
Kimura, Takashi
Application Number:
JP2005000359471
Publication Date:
June 28, 2007
Filing Date:
December 13, 2005
Export Citation:
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Assignee:
SHARP CORP
International Classes:
C03B33/09; B23K26/06; B23K26/073; B23K26/38; B23K26/40; B28D5/00; C03B33/00; B23K26/00; B23K26/06; B28D5/00