Title:
DIVIDING METHOD OF SEMICONDUCTOR SUBSTRATE
Document Type and Number:
Japanese Patent JPH07240392
Kind Code:
A
Abstract:
PURPOSE: To prevent damage of chip periphery or damage of a thin diaphragm part, when a semiconductor substrate is divided for manufacturing a sensor chip.
CONSTITUTION: A semiconductor substrate 1 is divided by applying ultrasonic vibration to the substrate from a vibrator 6, along division lines 9 of the substrate. It is also effective that trenches are previously formed on the division lines 9 by wet etching or dry etching.
Inventors:
UMEMOTO HIDETOSHI
Application Number:
JP3072194A
Publication Date:
September 12, 1995
Filing Date:
March 01, 1994
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD
International Classes:
H01L29/84; B06B1/00; H01L21/301; (IPC1-7): H01L21/301; B06B1/00; H01L29/84
Attorney, Agent or Firm:
Iwao Yamaguchi
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