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Patent Searching and Data


Title:
DIVIDING AND POLISHING METHOD FOR CHIP RAW MATERIAL WITH SINTERED DIAMOND
Document Type and Number:
Japanese Patent JP11099412
Kind Code:
A
Abstract:

To reduce the cost and remarkably improve work efficiency by obliquely cutting raw material formed of cemented carbide and sintered diamond at calculated rake angle and tip clearance angle, simultaneously imbedding a metallic support in a grooved sintered diamond, fixing the same by brazing the contact with the metallic support, and finishing only both side surfaces of a diamond chip.

A chip saw with sintered diamond is so constructed that a chip with divided sintered diamonds is fixed to the peripheral edge part of a metallic support formed like a disc by brazing to a brazed part of the metallic support. According to this method for dividing and manufacturing a chip raw material 4 with the sintered diamond, a raw material 4 having sintered diamond 2 on the upper surface and cemented carbide 3 on the lower surface is is obliquely cut by a cutting wire 5 at calculated rake angle 9 and tip clearance angle 10. Simultaneously with wire cutting, a groove 8 is provided, a metallic support is embedded in the sintered diamond, and the brazed part is brazed to be fixed to the metallic support, and only both side surfaces of the sintered diamond chip are polished to complete finishing.


Inventors:
Shimazu, Toshihiro
Application Number:
JP1997000302311
Publication Date:
April 13, 1999
Filing Date:
September 29, 1997
Export Citation:
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Assignee:
YSK KOGYO:KK
International Classes:
B23D61/02; B23K1/19; B24D3/00; B24D3/06; B24D5/12; B23D61/00; B23K1/19; B24D3/00; B24D3/04; B24D5/00; (IPC1-7): B23D61/02; B23K1/19; B24D3/00; B24D3/06; B24D5/12