Title:
ドアラッチ装置
Document Type and Number:
Japanese Patent JP7014490
Kind Code:
B2
Abstract:
Provided is a door latch device that can waterproof the entire surface of the circuit board. A door latch device 10 includes: a circuit board 120 electrically connected to an electric component; a first cover 22 that covers an inner surface of a case 20 to form a first housing space 36; a second cover 24 that covers an outer surface of the case 20 to form a second housing space 124 in which the circuit board 120 is housed; a pin hole 156 that establishes communication between the first housing space 36 and the second housing space 124; a pin 136 that is erected from the circuit board 120 and projects to the first housing space 36 through the pin hole 156; a pin holder 146 that covers the periphery of a base of the pin 136 to support the pin 136 with respect to the circuit board 120; an external waterproof seal 126 that waterproofs the second housing space 124 against the outside; and an internal waterproof seal 166 that is disposed between an edge of the pin holder 146 and the pin hole 156 to waterproof a space between the first housing space 36 and the second housing space 124.
More Like This:
Inventors:
Shintaro Okawa
Yasuyuki Watanabe
Yasuyuki Watanabe
Application Number:
JP2019141667A
Publication Date:
February 01, 2022
Filing Date:
July 31, 2019
Export Citation:
Assignee:
Mitsui Kinzoku Act Co., Ltd.
International Classes:
E05B77/34; B60J5/00; E05B81/42; E05B81/54; E05B85/02; E05B85/24
Domestic Patent References:
| JP6482537B2 | ||||
| JP2012110078A | ||||
| JP2017197912A | ||||
| JP2015224457A |
Foreign References:
| US20140175813 |
Attorney, Agent or Firm:
Sakai International Patent Office
Previous Patent: Process for producing functionalized polymers
Next Patent: Battery monitoring system
Next Patent: Battery monitoring system