To provide a polishing device of structure capable of polishing by pressurizing an upper surface plate, while securing the following performance of the upper surface plate, in regard to a planetary gear type polishing device.

In addition to the conventional suspension structure using a wire 9 for suspending the upper surface plate 5, a load transmitting portion for evenly transmitting a load, which works downward from an upper surface plate suspension plate 2, to the upper surface plate 5 through an upper surface plate connecting ring 13 is structured by disposing a pressurizing wire 12 for giving a pressure load to the upper surface plate 5 on the inner peripheral side. Polishing under pressure load conditions is thereby enabled.