To provide a double sided adhesive tape which is used for fixing a polishing cloth 13 for polishing the edge of a silicon wafer 15 to a MC nylon block 12 and can prevent that the double sided adhesive tape 14 for fixing the polishing cloth 13 to the board 12 is peeled from the block 12 during the polishing of the edge of the silicon wafer 15.
This double sided adhesive tape 14 for fixing a polishing cloth 13 for polishing the edge of a silicon wafer 15 to a nylon block 12 is characterized by comprising a tape substrate, a block side adhesive layer disposed on the block side surface of the tape substrate, and a polishing cloth side adhesive layer disposed on the polishing cloth side surface of the tape substrate, wherein the block side adhesive layer comprises an acrylic adhesive comprising an acrylate, a rosin ester and a terpene resin.
ANZAI KENICHI
MATSUMURA SHINICHI
