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Title:
両面金属張積層体とその製造方法、絶縁フィルムおよび電子回路基板
Document Type and Number:
Japanese Patent JP7458329
Kind Code:
B2
Abstract:
A method of producing a double-sided metal-clad laminate comprises a supplying step of supplying an insulating film interposed between two metal foils continuously to between a pair of endless belts, a heat and pressure applying step of forming a laminate of the insulating film and the metal foils by heating and applying a pressure to the insulating film and the metal foils under predetermined condition while the insulating film is interposed by the two metal foils in between the endless belts, and a cooling step of cooling the laminate, wherein the insulating film has a thickness of 10 to 500 µm, a degree of planar orientation of 30% or more, an average coefficient of linear expansion in an MD direction of -40 to 0 ppm/K and an average coefficient of linear expansion in a TD direction of 0 to 120 ppm/K. A double-sided metal-clad produced by the method, an insulating film used for the method and an electric circuit board using the double-sided metal-clad are also provided.

Inventors:
Ikuyoshi Inoda
Yusuke Masuda
Shun Uchiyama
Takako Ebisuzaki
Application Number:
JP2020568181A
Publication Date:
March 29, 2024
Filing Date:
January 22, 2020
Export Citation:
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Assignee:
Denka Company Limited
International Classes:
B32B15/08; B29C65/02; B32B37/06; B32B37/10; B32B37/14; H05K1/03; H05K3/00
Domestic Patent References:
JP8090570A
JP4216433B2
JP2001239585A
JP2001079947A
JP2010221694A
JP2011096471A
Foreign References:
WO2016170779A1
Attorney, Agent or Firm:
Patent Attorney Corporation Isono International Patent and Trademark Office