Title:
両面研磨装置
Document Type and Number:
Japanese Patent JP6965305
Kind Code:
B2
Abstract:
The present invention is a two-side polishing device equipped with: a lower platen that is provided so as to be rotatable about a rotating shaft and that has a polishing pad affixed to an upper surface thereof; an upper platen that is provided above the lower platen so as to be movable up and down and rotatable about the rotating shaft and that has a polishing pad affixed to a lower surface thereof; and a suspended top that is provided above the upper platen. The two-side polishing device is characterized by comprising: a connecting part that connects the suspended top and the upper platen; and an actuator that is provided between the suspended top and the upper platen, in a position different from the connecting part, and that is capable of deforming the shape of the upper platen. Due to this configuration, a platen moving mechanism is provided that enables the shape of a platen to be deformed into various shapes without promoting thermal deformation of the platen in a duplex polishing device in a suspended state.
Inventors:
Yuki Tanaka
Masashi Maruta
Masashi Maruta
Application Number:
JP2019075648A
Publication Date:
November 10, 2021
Filing Date:
April 11, 2019
Export Citation:
Assignee:
Shin-Etsu Semiconductor Co., Ltd.
Fujikoshi Machine Industry Co., Ltd.
Fujikoshi Machine Industry Co., Ltd.
International Classes:
B24B37/005; B24B37/08; B24B37/12; B24B37/14; H01L21/304
Domestic Patent References:
| JP4217456A | ||||
| JP7290356A | ||||
| JP2000225563A | ||||
| JP9309064A | ||||
| JP2004216492A | ||||
| JP2006150507A | ||||
| JP2010221348A | ||||
| JP2001071245A |
Attorney, Agent or Firm:
Mikio Yoshimiya
Toshihiro Kobayashi
Toshihiro Kobayashi
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