半導体装置の両面プロービング - Wentworth Laboratories, Inc.

Title:

半導体装置の両面プロービング

Document Type and Number:

Japanese Patent JP2007531878

Kind Code:

A

Abstract:

A probe head for testing the properties of a semiconducting device ( 10 ) under test including a dielectric film ( 24 ) supporting at least one semiconducting device ( 10 ) under test with a support frame ( 26 ) tautly supporting the dielectric film ( 24 ). A first support ( 40 ) positions a first probe ( 28 ) for electrically contacting a first side ( 16 ) of the semiconducting device ( 10 ) under test and a second support ( 34 ), having a actuator to move a second probe ( 30 ) between a first position (P 1 ) and a second position (P 2 ), positions second probe ( 30 ) with the second position (P 2 ) being for electrically contacting an opposing second side ( 18 ) of the semiconductor device under test.

Inventors:

Hope Jeremy
Overalls, Adrian, Earl.
Fitzpatrick, John, Jay.

Application Number:

JP2007506333A

Publication Date:

November 08, 2007

Filing Date:

March 30, 2005

Export Citation:

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