Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP3134341
Kind Code:
B2
Inventors:
▲高▼田 稔秋
Application Number:
JP10295091A
Publication Date:
February 13, 2001
Filing Date:
May 09, 1991
Export Citation:
Assignee:
NEC
International Classes:
H01L21/74; H01L21/331; H01L29/73; H01L29/732; (IPC1-7): H01L21/74; H01L21/331; H01L29/73
Domestic Patent References:
| JP49123589A | ||||
| JP6185863A | ||||
| JP593946A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)
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