Title:
DRESS SHEET AND PROCESSING METHOD USING DRESS SHEET
Document Type and Number:
Japanese Patent JP2015213969
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a dress sheet that efficiently dresses a cutting blade while cutting an object to be processed, without causing a problem such as pop of a chip and movement of a wafer, and to provide a processing method using the dress sheet.SOLUTION: In a dress sheet 1 stuck to a face of a wafer W, which is cut with a cutting blade, abrasive grains 23 are contained in a resin layer 2 in order to dress the cutting blade, and the dressing of the cutting blade is carried out in parallel with cutting. Additionally, since a dicing tape can be stuck to the rear face side of the wafer W, even if adhesion of the dress sheet 1 decreases due to the content of the abrasive grains 23, such a problem that pop of a chip or movement of the wafer W causes an abnormal shape of the chip can be prevented. Additionally, adhesion of cut waste to the face is prevented by sticking the dress sheet 1 to the face of the wafer W, which is cut with the cutting blade, and therefore, cutting satisfactory in processing quality can be performed.
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Inventors:
ISHII TAKAHIRO
SEKI TATSUYA
SEKI TATSUYA
Application Number:
JP2014096663A
Publication Date:
December 03, 2015
Filing Date:
May 08, 2014
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B53/00; B24B53/12; H01L21/301
Domestic Patent References:
| JP2010129622A | 2010-06-10 |
Foreign References:
| US20080124896A1 | 2008-05-29 |
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office
Kyoko Kawamura
Isao Sasaki
Ken Kubo
Kyoko Kawamura
Isao Sasaki
Ken Kubo