To provide a dresser for a CMP processing capable of sufficiently dressing by a dressing treatment and holding grinding capability for a polishing pad for a long period of time.
The dresser 4 is used for performing the dressing treatment for the polishing pad provided on the CMP processing device. The dresser 4 for the CMP processing is equipped with an approximately circular support surface 4b opposed to the polishing pad, three or more belt-like abrasive grain holding parts 41A-41H approximately radially extended from a central part 4c of the support surface 4b, a plurality of abrasive grain holding parallel parts 42 which are in an approximately fan-shaped area M clipped by adjacent abrasive grain holding parts 41A-41H with each other and disposed in parallel with either one of abrasive grain holding parts 41A-41H, and a belt-like abrasive grain non-holding part 43 which is in the approximately fan-shapes area M and provided respectively between one side of the abrasive grain holding parts 41A-41H and the plurality of abrasive grain holding parallel parts 42.
| JP2006205314A | 2006-08-10 | |||
| JPH11300601A | 1999-11-02 | |||
| JPH11239979A | 1999-09-07 | |||
| JPH08243914A | 1996-09-24 | |||
| JPS5035270B1 | 1975-11-14 | |||
| JP2001157967A | 2001-06-12 | |||
| JP2002046072A | 2002-02-12 | |||
| JP3123256U | 2006-07-20 |
| US20060128288A1 | 2006-06-15 |
Tadashi Takahashi
Naoki Ofusa
Kazunori Onami