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Title:
ドレッシングボード、及びドレッシング方法
Document Type and Number:
Japanese Patent JP7374793
Kind Code:
B2
Abstract:
To provide a dressing board and a dressing method which enable a cutting device that cuts a work-piece under a dry-type environment to execute wet-type dressing, while maintaining the dry-type environment.SOLUTION: A dressing method, which is performed using a dressing board 30 which comprises a flat part 32 for dressing a cutting edge 22a of a cutting blade 22 and side wall parts 34 surrounding an outer periphery of the flat part 32 and has a water storage region 36 surrounded by the flat part 32 and the side wall parts 34 formed therein. The dressing method comprises: a dressing board placement step of placing the dressing board 30 on holding means 12; a water storage step of supplying water W into the water storage region 36 of the dressing board 30 and storing the water therein; and a dressing step of making the cutting means 20 move in a direction perpendicular to the dressing board 30, making the cutting edge 22a of the rotated cutting blade 22 enter the water storage region 36 storing the water W and then making the cutting edge cut into the flat part 32 to perform dressing.SELECTED DRAWING: Figure 6

Inventors:
Omae scroll
Application Number:
JP2020015396A
Publication Date:
November 07, 2023
Filing Date:
January 31, 2020
Export Citation:
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Assignee:
Disco Co., Ltd.
International Classes:
B24B53/00; B24B53/12; H01L21/301
Domestic Patent References:
JP2007203429A
JP2017213613A
JP6055440A
JP2018117091A
Attorney, Agent or Firm:
Atago Patent Attorneys Office
Sachiko Okunuki
Tsuyoshi Tsukano
Yoshifumi Kaneko