Title:
ドレッシングプロセスの監視方法および研磨装置
Document Type and Number:
Japanese Patent JP5927083
Kind Code:
B2
Abstract:
A method of monitoring dressing of a polishing pad is provided. The method includes: rotating a polishing table that supports the polishing pad; dressing the polishing pad by pressing a dresser against the polishing pad while causing the dresser to oscillate in a radial direction of the polishing pad; calculating a work coefficient representing a ratio of a frictional force between the dresser and the polishing pad to a force of pressing the dresser against the polishing pad; and monitoring dressing of the polishing pad based on the work coefficient.
Inventors:
Hiroyuki Shinozaki
Application Number:
JP2012187383A
Publication Date:
May 25, 2016
Filing Date:
August 28, 2012
Export Citation:
Assignee:
Ebara Corporation
International Classes:
B24B53/00; B24B37/00
Domestic Patent References:
| JP2011530809A | ||||
| JP11138418A |
Foreign References:
| WO2011139501A1 |
Attorney, Agent or Firm:
Isamu Watanabe
Ryoji Kosugi
Tetsuya Hirosawa
Ryoji Kosugi
Tetsuya Hirosawa