Title:
PANEL SWITCH BOARD AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JP3207894
Kind Code:
B2
Abstract:
PURPOSE: To provide a method to manufacture a panel switch board furnished with projected key-tops simply and accurately without use of any die or rotary drum.
CONSTITUTION: A resin 3 is dropped onto the center of a switch pressing position 2 on a base sheet 1 in such a way that the central part bulges and 1 are hardened to form a projected key-top 6. The locational preciseness of each key-top can be improved by furnishing a die around the switch pressing position and pouring the resin into this die. One preferable example of resin is ultraviolet hardening type, and recommended die forming methods are the photosensitive resist method and screen printing method. It may also be accepted that each key-top consists in a single piece molding of a bulge of a clear plastic and a die provided around it. The panel switch board thus produced has key-tops each having a bulging center, which excels in the design, perceptivity, and easiness in operating.
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Inventors:
Daiji Kobayashi
Sumio Katsura
Toshiharu Otsuka
Yoichiro Kamei
Sumio Katsura
Toshiharu Otsuka
Yoichiro Kamei
Application Number:
JP29849791A
Publication Date:
September 10, 2001
Filing Date:
October 16, 1991
Export Citation:
Assignee:
Nippon Denki Kagaku Co., Ltd.
International Classes:
H01H11/00; H01H13/70; H01H13/702; (IPC1-7): H01H11/00; H01H13/70
Domestic Patent References:
| JP4209427A | ||||
| JP63310525A | ||||
| JP4166268A |
Attorney, Agent or Firm:
Noriko Murata
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