Title:
ドリル加工装置及びドリル加工方法
Document Type and Number:
Japanese Patent JP7292186
Kind Code:
B2
Abstract:
To improve accuracy of a depth in drilling a blind hole in a substrate having a curved and raised portion.SOLUTION: First operation by which a first surface height of a substrate is detected at a specific position in the substrate on the basis of a detection signal from a drill-contact detection part with a substrate pressing part pressing the substrate against, and second operation by which a second surface height of the substrate is detected at the specific position or in the vicinity of the position on the basis of the detection signal from the drill-contact detection part with the substrate pressing part not pressing the substrate against are performed, and when a difference between the first surface height and the second surface height surpasses a predetermined value, it is controlled so that at least a region including the specific position is not to be processed.SELECTED DRAWING: Figure 1
Inventors:
Hideyuki Takamitsu
Yujiro Araki
Kosuke Suzuki
Yujiro Araki
Kosuke Suzuki
Application Number:
JP2019205155A
Publication Date:
June 16, 2023
Filing Date:
November 13, 2019
Export Citation:
Assignee:
Via Mechanics Co., Ltd.
International Classes:
B26F1/16; B23B41/00; B23B49/00; B23Q15/00; B23Q17/22; G05B19/19; G05B19/404; H05K3/00
Domestic Patent References:
| JP2003001548A | ||||
| JP2016122825A | ||||
| JP2015223686A | ||||
| JP2016016458A | ||||
| JP2006119857A |