To provide a drilling method for a material transparent to a laser by using the irradiation of an ultrashort pulse laser and wet etching in combination, wherein the working quality is improved on the surfaces nearby the inlets and outlets of holes formed in the material and on the wall faces of the holes, and the shape of the holes formed in the material is the straight and columnar one as much as possible.
The drilling method is provided with: a process where an ultrashort pulse layer 11 is applied to the inside of a material 20 such as quartz glass transparent to a laser, and an altered layer 23 along the thickness direction of the material between the surface 21 and the back face 22 in the material 20 is produced only on the inside of the material 20; a process where the material 20 is patterned with etching protective films 25 opening in the regions corresponding to the altered layer 23 in the surface 21 and the back face 22 of the material 20 and covering the other regions; and a process where the material 20 is dipped into an etching liquid 30, and the materials between the openings 26 of the surface 21 and the back face 22 facing across the altered layer 23 are removed.
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UMETSU KAZUNARI
AMAKO ATSUSHI
Souji Sasaki
Saburo Kimura
Noboru Omura