PURPOSE: To provide a drilling method of a printed wiring board capable of certainly preventing appearance of a crack and a chip on a bonded layer on the surface of a substrate at the time of drilling without thickening a batten.

CONSTITUTION: In the case of manufacturing a printed wiring board by the additive process, after a bonded layer 2 formed on the surface of a substrate 1 is roughed, a batten 3 is attached on the surface of the bonded layer 2 with an adhesive, a specified hole is drilled with a drill 6 in that state, and thereafter, the batten 3 is removed from the bonded layer 2 and the adhesive is removed from the bonded layer 2.