Title:
DRIVE CIRCUIT
Document Type and Number:
Japanese Patent JP2018032862
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a driver IC having high-speed drivability, low power consumption and in which damage or peeling due to stress addition hardly occurs, a display unit having the driver IC, and a manufacturing method for the driver IC.SOLUTION: A layer for forming a drive circuit has a laminated structure of at least two layers composed of a first layer including a transistor using a monocrystal semiconductor film as an active layer and a second layer including a transistor using an oxide semiconductor film as an active layer. The layer for forming the drive circuit includes at least a shift register circuit, a latch circuit, and a switching circuit, and the latch circuit includes the transistor using the oxide semiconductor film as the active layer as a part of a component.SELECTED DRAWING: Figure 1
Inventors:
YAMAZAKI SHUNPEI
ONUMA HIDETO
TAKAHASHI KEI
ONUMA HIDETO
TAKAHASHI KEI
Application Number:
JP2017178725A
Publication Date:
March 01, 2018
Filing Date:
September 19, 2017
Export Citation:
Assignee:
SEMICONDUCTOR ENERGY LAB CO LTD
International Classes:
H01L29/786; G02F1/133; G02F1/1345; G02F1/1368; G09F9/30; H01L21/8234; H01L21/8238; H01L27/06; H01L27/088; H01L27/092; H01L27/32; H01L51/50; H03K3/356; H05B33/14
Domestic Patent References:
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| JPH08137443A | 1996-05-31 | |||
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Foreign References:
| US20070063959A1 | 2007-03-22 | |||
| US20110187410A1 | 2011-08-04 | |||
| US20080284710A1 | 2008-11-20 |