PURPOSE: To cool a base body to be treated, which is etched in a vacuum vessel, and to obtain a device capable of improving the reliability of etching by placing the base body to be treated on a tray with an electrostatic chuck mechanism, taking the tray into and out from an etching chamber and fast sticking the tray to an electrode during etching.

CONSTITUTION: A vessel 10 with oppositely arranged first and second electrodes 11 and 12, a means 18 introducing a gas into the vessel 10, a means 19 exhausting the gas in the vessel 10, means 15 and 16 applying high-frequency power to said first electrode 11 or first and second both electrodes 11 and 12 and a means 17 cooling the first electrode 11 are provided. A tray 14, on which a base body to be treated 13 is placed and which is put onto the first electrode 11, a means 28 applying voltage between the tray 14 and the base body to be treated 13 and electrostatically sucking the base body 13 onto the tray 14, means 21 and 22 carrying the tray 14 between the upper section of the first electrode 11 in the vessel 10 and the outside of the vessel and a means fast sticking the tray 14 to the first electrode 11 are further furnished. Said tray 14 consists of a metallic plate such as a metallic plate 14a, the surface of which is coated with a high dielectric film 14b.