To provide a drying device for drying a semiconductor wafer with high effectiveness within a limited wind force range, and scattering and removing also the cut remains.

In the drying device A, a semiconductor wafer 1 is moved along a straight transport path 3, while it faces upward and air from an air injection nozzle 6 is injected downward towards the surface for drying the semiconductor wafer 1. In the drying device A, a plurality of air injection nozzles 6 are arranged over nearly the entire region of the side width of the transport path along a direction for crossing the semiconductor wafer transport path 3, and air from the air-injection nozzle 6 is injected with respect to cut grooves X and Y into a lattice shape which is carved on the surface of the semiconductor wafer 1 as in a plan view.