To provide an electron microscope and FIB system for processing and imaging of a variety of materials using two separate laser beams of different characteristics.

The first laser beam is used for large bulk material removal and deep trench etching of a workpiece. The second laser beam is used for finer precision work, such as micromachining of the workpiece, small spot processing, or the production of small heat affected zones. The first laser beam and the second laser beam can be produced from the same laser source or from separate laser sources. Using one laser source provides the additional benefits of making the system cheaper and allowing an external station and an internal station to be arranged separately such that debris generated from bulk material removal with the first laser beam does not interfere with vacuum or components inside a particle beam chamber.