Title:
ダミーウェーハ及びダミーウェーハの製造方法
Document Type and Number:
Japanese Patent JP7233815
Kind Code:
B2
Abstract:
To easily manufacture a dummy wafer.SOLUTION: A dummy wafer includes: a wafer; a resin sheet in a close contact with the top of the wafer; and a plurality of spheres fixed to the wafer through the resin sheet. A method for manufacturing a dummy wafer having a plurality of spheres provided on the upper surface includes: a sheet lamination wafer formation step of mounting a resin sheet on the upper surface of a wafer and heating the wafer, and forming a sheet lamination wafer in a close contact with the resin sheet on the upper surface of the wafer; a sphere arrangement step of performing the sheet lamination wafer formation step, and then arranging the plurality of spheres on the resin sheet; and a fixing step of performing the sphere arrangement step, and then heating the sheet lamination wafer where the plurality of spheres are arranged, and fixing the spheres to the wafer through the resin sheet.SELECTED DRAWING: Figure 2
Inventors:
Masahiro Kobayashi
Application Number:
JP2019025981A
Publication Date:
March 07, 2023
Filing Date:
February 15, 2019
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/02
Domestic Patent References:
| JP2018085476A |
Attorney, Agent or Firm:
Matsumoto
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano