PURPOSE: To effectively prevent sticking of sputtering scum to a substrate by providing ultrasonic oscillating means to members, exclusive of the substrate, on which thin films are stuck and formed at the time of film formation, and applying oscillation thereto at the time exclusive of the film formation, thereby forcibly exfoliation the thin films.
CONSTITUTION: The oscillation devices are respectively provided to a cathode 2, an anode 4 and a shutter 7, exclusive of the substrate 5, on which the thin films are stuck and formed, at the time of the film formation with a film forming device 1 which forms the thin films on the substrate 5 in a vacuum vessel 1a the pressure in which is reduced to the specified pressure. The oscillation devices are constituted of horns 12, oscillators 13 and high-frequency power sources 14 and are held to the vacuum vessel 1a by means of elastic bodies 15. The power sources 14 are turned on and the oscillation is generated by the horns 12 to forcibly exfoliate the thin films (sputtering scum) sticking to the surfaces of the respective members before or after the start of the film formation in this constitution. The exfoliated films are removed by slow discharge. The degradation of the quality of the thin film on the substrate is prevented in this way.
TAKEUCHI HIDEAKI
YANAI AKIO
