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Title:
ＥＭＩ遮蔽組成物およびそれを適用する方法
Document Type and Number:
Japanese Patent JP6532890
Kind Code:
B2
Abstract:
This invention relates to an EMI shielding composition comprising a thermoplastic resin and/or a thermoset resin, a solvent or a reactive diluent and conductive particles providing uniform and homogenous thickness to the EMI shielding layer. The invention also provides a process of applying the EMI shielding layer on the encapsulant protecting the CI device components.

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Inventors:
Fan wonsion
Yao Wei
Application Number:
JP2016563092A
Publication Date:
June 19, 2019
Filing Date:
April 18, 2014
Export Citation:
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Assignee:
Henkel AG & Co. KGaA
International Classes:
H01L23/29; C08K3/08; C08L101/00; C09D7/40; C09D127/00; C09D133/00; C09D163/00; C09D201/00; H01B1/22; H01B13/00; H01L23/00; H01L23/31
Domestic Patent References:
JP63275150A
JP7022541A
JP10092981A
JP2006335976A
Foreign References:
WO2012101857A1
US20030015334
US20080045063
WO2003053117A1
Attorney, Agent or Firm:
Michiko Matsutani
Kenichi Morizumi
Haruhiko Ema



 
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