Title:
ヘッドホン用イヤパッド及びヘッドホンおよびイヤーマフ
Document Type and Number:
Japanese Patent JP6651687
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an ear pad and a headphone capable of adjusting airtightness by increasing or decreasing side pressure.SOLUTION: An ear pad 3 includes a ring-shaped pad portion 3 surrounding a user's ear. The pad portion 3 is attached to housings provided at both ends of the headband and has a gap G forming a path for communicating an internal space surrounding the user's ear with an external space. The gap G is reduced as the ear pad is compressed in a thickness direction.SELECTED DRAWING: Figure 5
Inventors:
Hiroshi Akino
Application Number:
JP2015243817A
Publication Date:
February 19, 2020
Filing Date:
December 15, 2015
Export Citation:
Assignee:
Audio Technica Co., Ltd.
International Classes:
H04R1/10
Domestic Patent References:
| JP54087523A | ||||
| JP2010010984A | ||||
| JP1196999A | ||||
| JP2009105841A |
Foreign References:
| US20100218775 |
Attorney, Agent or Firm:
Yoshiyuki Ishibashi