Title:
イヤホン組付体
Document Type and Number:
Japanese Patent JP5793566
Kind Code:
B2
Abstract:
An earphone assembly for an in-ear listening device is disclosed. The earphone assembly has an inner housing comprising a nozzle, configured to receive a sleeve for placement into a user's ear, and a balanced armature motor assembly. The balanced armature motor assembly is mounted in the inner housing so as to form an acoustical seal between the inner housing and the balanced armature motor assembly. The earphone assembly also includes an outer housing configured to receive the inner housing. The inner housing can comprise a recess for receiving a paddle of the balanced armature motor assembly. Alternatively, the outer housing can be formed with a nozzle for receiving a sleeve for placement into a user's ear canal, and the inner housing can comprise a spout, which is received in a recess in the outer housing.
Inventors:
Al Wicker, Michael Joseph
Devlin, John Pee.
Brenneman, Mark Buoy
Devlin, John Pee.
Brenneman, Mark Buoy
Application Number:
JP2013518703A
Publication Date:
October 14, 2015
Filing Date:
June 30, 2011
Export Citation:
Assignee:
SHURE ACQUISITION HOLDINGS,INC.
International Classes:
H04R1/10; H04R11/02; H04R25/00
Domestic Patent References:
| JP57171396U | ||||
| JP2006033417A | ||||
| JP2008193449A | ||||
| JP11146495A | ||||
| JP2007074499A | ||||
| JP2004529767A | ||||
| JP2009153103A |
Foreign References:
| US20090296971 | ||||
| US20060153418 |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Masakazu Ito
Yuko Hara
Masakazu Ito
Yuko Hara