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Patent Searching and Data


Title:
EARPHONE
Document Type and Number:
Japanese Patent JP2018019306
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To especially suppress attenuation of high sound area components in an earphone comprising a plurality of driver units having different reproduction bands.SOLUTION: The earphone comprises: first driver units (2d, 2e) for reproducing voice waves including a high sound area; second driver units (2e, 2f) for reproducing voice waves other than those in a reproduction band of the first driver units: a unit case 3 for storing those respective driver units; and a sound conduit 4 formed to communicate with the unit case for guiding the voice waves from the respective driver units to the external auditory canal of a user. Sound emitting axes A1 of the first driver units and sound emitting axes A2 of the second driver units are arranged so as to be made in parallel with each other, and the sound emitting axes A1 of the first driver units are configured to pass in an opening 8a of the sound conduit 4.SELECTED DRAWING: Figure 1

Inventors:
TSUBONE KODAI
Application Number:
JP2016149206A
Publication Date:
February 01, 2018
Filing Date:
July 29, 2016
Export Citation:
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Assignee:
AUDIO TECHNICA KK
International Classes:
H04R1/10; H04R11/02
Attorney, Agent or Firm:
Kinoshita Shigeru