To provide a curable resin film exhibiting high adhesion to a conductor and excellent electrical characteristics being employed in a build-up system multilayer wiring board in which an electroless plating film can be formed with high reliability.

A curable resin film being employed for forming an insulation layer in a multilayer printed wiring board comprises (a) a layer formed of a resin composition containing polyphenylene ether resin and triarylisocyanurate and/or triarylisocyanurate, and (b) a layer formed of a compound or a polymer compound having glass transition point of 200°C or below and containing at least one kind of atom selected from oxygen atom, nitrogen atom and sulfur atom and an aromatic ring wherein at least one outermost layer of the film is formed of the layer (b). A cured film is obtained by curing the resin film.