Title:
イーストパイ
Document Type and Number:
Japanese Patent JP7019242
Kind Code:
B2
Abstract:
To provide a yeast pie in which the eat-texture has crispy-feeling, good crunchiness and collapse feeling; and a yeast pie dough for producing said yeast pie.SOLUTION: Provided is a yeast pie dough in which 7 to 25 pts.mass of the following oil/fat composition A for kneading are kneaded into 100 pts.mass of grain flour. Oil/fat composition A for kneading: an oil/fat composition for kneading in which the solid fat content of the oil/fat contained is 60% or more at 5°C, 25 to 45% at 15°C, 10 to 35% at 20°C, and 3 to 15% at 35°C.SELECTED DRAWING: None
Inventors:
Naoto Kataoka
Kenichi Kumagai
Kenichi Kumagai
Application Number:
JP2017209765A
Publication Date:
February 15, 2022
Filing Date:
October 30, 2017
Export Citation:
Assignee:
Nisshin Oillio Group Co., Ltd.
International Classes:
A23D9/00; A21D2/16; A21D13/16; A23D7/00
Domestic Patent References:
| JP2010057405A | ||||
| JP2010148471A | ||||
| JP2004305048A |