Title:
設置容易な半導体及びＬＣＤ製造工程の排気ガス加熱用三重配管加熱装置
Document Type and Number:
Japanese Patent JP6857931
Kind Code:
B2
Abstract:
The present invention relates to a triple pipe heating device for heating an exhaust gas in a semiconductor and LCD manufacturing process, which has a triple pipe structure capable of effectively heating an exhaust gas with only a small amount of heat without using nitrogen gas, is expandable and bendable so as to be easily installed, and is capable of quickly detecting exhaust gas leakage and overheating.
Inventors:
Isung Young
Application Number:
JP2020509403A
Publication Date:
April 14, 2021
Filing Date:
March 27, 2018
Export Citation:
Assignee:
J-Solution Company Limited
International Classes:
H01L21/31; F27D17/00; F27D21/00; H01L21/02
Domestic Patent References:
| JP6137470A | ||||
| JP10199818A | ||||
| JP2004537844A | ||||
| JP2000150387A |
Foreign References:
| KR101530612B1 | ||||
| KR101075170B1 | ||||
| KR1020130118455A |
Attorney, Agent or Firm:
Tsuyoshi Yamada