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Title:
EBG ELEMENT, ITS ARRAY STRUCTURE, AND HIGH-FREQUENCY CIRCUIT
Document Type and Number:
Japanese Patent JP2009021770
Kind Code:
A
Abstract:

To provide an EBG element capable of successfully performing leak cutoff to a broadband high-frequency circuit.

An antenna 102 on an insulating film 101 of a substrate 100 is connected to a transmission path 104 in the insulating film 101, many MIMs (layered thin-film capacitors) 110 are formed near the antenna 102. One electrode of each MIM 110 is connected top a GND electrode 112 on the rear side of the substrate 100 and the other electrode is connected to an electric supply line 114. As a dielectric film 110a of the MIM 110, a perovskite system dielectric material, for example, BSTO ((Ba, Sr)TiO3) whose capacitance varies according to applied voltage is used. Thus, a cutoff frequency of the EBG element, namely, cutoff frequencies of leak components from the antenna 102 and the transmission path 104 are varied by varying the applied voltage to the electric supply line 114.


Inventors:
ICHINOSE HIDEO
OTA KENICHI
TAKAHASHI TOMOYUKI
Application Number:
JP2007182170A
Publication Date:
January 29, 2009
Filing Date:
July 11, 2007
Export Citation:
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Assignee:
TAIYO YUDEN KK
International Classes:
H01P3/08; H01G7/06; H01L21/822; H01L27/04
Attorney, Agent or Firm:
Yasutoshi Kajiwara