Title:
EBULLITION COOLING DEVICE
Document Type and Number:
Japanese Patent JP2022177463
Kind Code:
A
Abstract:
To provide an ebullition cooling device which enables further improvement of cooling performance.SOLUTION: A heat receiving section 11 comprises: a heat transfer wall 2 which has an attachment surface to which a cooled object 9 is attached and an uneven surface formed by multiple recessed strips provided at an area excluding the attachment surface; and a metallic porous body 3 which is attached so as to overlap on the uneven surface 21 of the heat transfer wall and in which multiple through holes 30 are formed, one opening of each through hole faces the uneven surface 21, and the other opening is open to a space opposite the uneven surface. At least the uneven surface 21 of the heat transfer wall 2 and the metallic porous body 3 are immersed in a refrigerant liquid 10. The uneven surface 21 of the heat transfer wall is an inclined surface or a vertical surface whose height position changes in one direction along an extending direction of the recessed strips 22. At least an upper end 22a located at a higher position of both ends as seen in the extending direction of the recessed strips 22 is open.SELECTED DRAWING: Figure 1
Inventors:
IDE TAKUYA
MURAKAMI MASAAKI
NUMATA TOMIYUKI
MURAKAMI MASAAKI
NUMATA TOMIYUKI
Application Number:
JP2021083732A
Publication Date:
December 01, 2022
Filing Date:
May 18, 2021
Export Citation:
Assignee:
LOTUS THERMAL SOLUTION INC
International Classes:
F28D15/02; H01L23/427; H05K7/20
Attorney, Agent or Firm:
Yoshihide Yanagino
Takao Yanagino
Norio Morioka
Sekiguchi Hisayu
Masato Nakagawa
Takao Yanagino
Norio Morioka
Sekiguchi Hisayu
Masato Nakagawa
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