To provide an edge polishing device capable of performing mirror- polishing of the whole of an edge with the one surface of a workpiece held, and to provide an edge polishing method.

A silicon wafer W is rotated with the wafer inclined by a vacuum chuck 9. The silicon wafer W is moved to the ratating polishing drums 1 and 3 sides, and the slope on the back side of an edge part Wc1 and the end face of the edge part Wc3 are simultaneously mirror-polished by the polishing drums 1 and 3. Thereafter, the silicon wafer W is moved to the polishing drums 2 and 4 side under rotation as it is, and the slope on the surface side of an edge part Wc2 and the end face of the edge part Wc4 are simultaneously mirror-polished by the polishing drums 2 and 4.