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Title:
発泡性ポリアミド
Document Type and Number:
Japanese Patent JP2011526315
Kind Code:
A
Abstract:
Thermoplastic molding compositions comprising A) from 10 to 99.9% by weight of at least one thermoplastic polyamide B) from 0.1 to 50% by weight of a copolymer obtainable via (i) preparation of at least one reaction mixture (a) via free-radical copolymerization of one or more monoethylenically unsaturated monomeric compound(s) (monomer(s) B1) with one or more compound(s) selected from the group of itaconic acid, mesaconic acid, fumaric acid, maleic acid, aconitic acid, glutaconic acid, and salts, esters, and anhydrides thereof (monomer(s) B2), and (ii) if appropriate, reaction of at least one of the copolymers obtained in step (i) with one or more crosslinking agent(s) (b), and C) from 0 to 60% by weight of further additives, where the total of the percentages by weight of components A) to C) is 100%.

Inventors:
Francesca aurenta
Cecil Zivo
Arnold Schneller
Martin weber
Application Number:
JP2011515281A
Publication Date:
October 06, 2011
Filing Date:
June 09, 2009
Export Citation:
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Assignee:
BASF SE
International Classes:
C08L77/00; C08J9/00; C08L35/00; B60J5/04
Attorney, Agent or Firm:
Takuya Kuno
Toshio Yano
Takahashi
Kimihiro Hoshi
Hiroyasu Ninomiya
Ryoichi Shino
Einzel Felix-Reinhard