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Title:
EJECTION AMOUNT MEASUREMENT METHOD, PATTERN FORMATION METHOD, DEVICE, ELECTRO-OPTICAL DEVICE AND ELECTRONIC EQUIPMENT
Document Type and Number:
Japanese Patent JP2007152340
Kind Code:
A
Abstract:

To provide a measurement method of an ejection amount approximate to that upon plotting pattern formation.

The ejection amount measurement method of liquid material comprises: an ejection process (S2) for measurement of driving a droplet ejection head based on ejection data for measurement and ejecting liquid material as a droplet from a nozzle by setting the ejection number so as to become a measurable amount; a measurement process (S3) of measuring the ejection amount of ejected liquid material; and a calculation process (S4) of calculating a mean ejection amount from the measured ejection amount and the ejection number, wherein the ejection data approximate to those when the plotting pattern is ejected and plotted as the ejection data for measurement are used.


Inventors:
KATO TAKESHI
Application Number:
JP2006252482A
Publication Date:
June 21, 2007
Filing Date:
September 19, 2006
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
B05D3/00; B05D1/26; B41J2/175; G01G17/04; G02B5/20; H01L51/50; H05B33/10
Domestic Patent References:
JP2004209429A2004-07-29
Attorney, Agent or Firm:
Masahiko Ueyanagi
Kazuhiko Miyasaka