Title:
エジェクタ装置
Document Type and Number:
Japanese Patent JP7071433
Kind Code:
B2
Abstract:
The invention discloses an ejector device for ejecting a chip disposed on a thin film. The chip has a first length in a first direction and a first width in a second direction. The ejector device comprises a pin cover defining a contacting surface. A pin hole, disposed on the contacting surface, has a second length in the first direction and a second width in the second direction. The contacting surface is configured to come into contact with the thin film. When the first length is larger than the second length, the first width is not larger than the second width. When the first width is larger than the second width, the first length is not larger than the second length.
Inventors:
Cai Shunwei
Application Number:
JP2020079916A
Publication Date:
May 18, 2022
Filing Date:
April 30, 2020
Export Citation:
Assignee:
Chroma Ate Inc.
International Classes:
H01L21/50; H01L21/301; H01L21/52
Domestic Patent References:
| JP2015065367A | ||||
| JP2001118862A | ||||
| JP2010232678A |
Attorney, Agent or Firm:
Koji Murai
Takeharu Miyagaki
Takeharu Miyagaki
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