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Title:
ELASTIC BED MATERIAL FOR PACKAGING AIR CONDITIONING APPARATUS
Document Type and Number:
Japanese Patent JPH06221592
Kind Code:
A
Abstract:

PURPOSE: To achieve a bending of a refrigerant piping in dimensions and a shape as specified easily and quickly even in the installation site by forming a bending mold integral in a specified surface of an elastic bed material for package to match a bending shape of the refrigerant piping.

CONSTITUTION: Bending molds 6a, 6b and 6c are formed integral in a specified surface 5a of an elastic bed material 5 for package comprising styrene foam or the like to match a bending shape of a refrigerant piping 1. Hence, a hole is selected from those 11a, 11b and 11c to pierce a refrigerant piping 1 according to the position and the attitude in the installation of an air conditioning apparatus. Thereafter, a connection metal 2 connected to the tip of the refrigerant piping 1 is fitted into a recess 6d and bending molds 6a, 6b and 6c are selected according to the selection of the hole and a bending of the refrigerant piping 1 is performed to match the bending mold selected. This enables the bending of the refrigerant piping 1 easily and quickly in dimensions, and a shape as specified.


Inventors:
HOSOME FUTOSHI
ITO MASAMI
Application Number:
JP3110593A
Publication Date:
August 09, 1994
Filing Date:
January 28, 1993
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD
International Classes:
F24F1/00; (IPC1-7): F24F1/00
Attorney, Agent or Firm:
Toru Suganuma (2 outside)



 
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