Title:
ELASTIC WAVE DEVICE PACKAGE
Document Type and Number:
Japanese Patent JP2022112576
Kind Code:
A
Abstract:
To provide an elastic wave device package appropriately having high heat dissipation characteristics while ensuring high integration of an elastic wave device and a package substrate.SOLUTION: An elastic wave device package D includes: an acoustic wave device 1 having an electrode pattern including a comb electrode formed on one surface 1b of a piezoelectric substrate 1a; a package substrate 2 on which the acoustic wave device 1 is mounted with a gap G formed between the package substrate and the one surface 1b of the acoustic wave device 1; a resin layer 3 including a first portion 3a formed on the mounting side of the package substrate 2 and covering at least a part of the other surface 1c of the acoustic wave device 1 and a second portion 3b sealing the gap G; and a metal layer 4 formed to cover the resin layer 3. The first portion 3a of the resin layer 3 is formed so as to form an uncovered portion 3c exposing the other surface 1c of the acoustic wave device 1, and the other surface 1c of the acoustic wave device 1 facing the uncovered portion 3c is covered with the metal layer 4.SELECTED DRAWING: Figure 1
Inventors:
NAKAMURA HIROBUMI
KUMAGAI KOICHI
KADOKAWA YUTAKA
KUMAGAI KOICHI
KADOKAWA YUTAKA
Application Number:
JP2021008415A
Publication Date:
August 03, 2022
Filing Date:
January 22, 2021
Export Citation:
Assignee:
MITSUYASU JAPAN TECH CO LTD
International Classes:
H03H9/25
Attorney, Agent or Firm:
Nobuhiko Nakamura