To provide a multilayer electric circuit board and a production method therefor with which the defects of a conventional multilayer electric circuit board, a production method therefor and production technology are partially or entirely overcome by enabling selective, efficient and highly reliable wiring among several or all various components including the surface and/or portions of the multilayer electric circuit board.
This multilayer electric circuit board is provided with a first circuit portion (60) having an upper surface and a bottom surface; first pre- circuit assembly (66) bonded to the upper surface of the first circuit portion and provided with an upside conduction layer (72); second pre-circuit assembly (74) bonded to the bottom surface of the first circuit portion and provided with a bottom side conduction layer (76); opening (86) formed over the first circuit portion, the first pre-circuit assembly, and the second pre-circuit assembly; and plural tab-like parts integrally formed by the upside conduction layer, expanded through the opening, and coupled to the bottom side conduction layer.
PHAM CUONG VAN
GLOVATSKY ANDREW Z
KRAUTHEIM THOMAS BERND
BELKE ROBERT EDWARD JR
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