To facilitate the soldering of an electronic component for surface mounting to a mounting substrate by enhancing the coplanarity precision of an external connection terminal.
Terminal slide potions 42a, 43a and 44a are formed at one-side ends of patterns 42, 43 and 44 printed on a substrate 4, and external connection terminals 5 are bent substantially in a lateral U-shape to have slide contact portions 5b and 5c at tips thereof. The external connection terminals 5 are attached so that the slide contact portions 5b and 5c clamp the terminal slide portions 42a, 43a and 44a of the substrate 4. Consequently, soldering portions 5a of the respective external connection terminals 5 can be adjusted in position in a direction orthogonal to a surface of a mounting-destination substrate 7, so that the respective soldering portions 5a can be enhanced in coplanarity precision to easily mount the substrate on the mounting destination substrate 7 by reflow soldering.
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