To provide an electric connection member having a connection surface having a metallized layer fitted to the requirement of micronization, high aspect and mutual connection, and to provide a method of manufacturing the same.
The electric connection member 1 comprises a first connection part 3 comprising a melt-connecting soldering layer and a second connection part 4 comprising a gold layer capable of wire bonding which are formed on an electric connection member body part 2. The method of manufacturing the same includes a step of forming a photoresist layer having a plated opening part by photolithography, the first connection 3, the electric connection member body part 2 and the second connection part 4 successively on a substrate having electric conductivity by a wet plating method and separating the electric connection member 1 from the substrate.
Noriaki Uchino
Nobuyuki Kimura