ELECTRIC CONTACT STRUCTURE FROM FLEXIBLE WIRE

Japanese Patent JP2001077250

A

To make improvements in an interconnection between microelectronic components by a method wherein a flexible extension element is mounted on a contact region on the electronic component and so formed as to be elastic.

A wire 502 is wrapped up in or covered with a first inner coating layer 520, and the first inner coating layer 520 is coated with a second outer coating layer 522 for the formation of a wire stem 530. The first layer 520 of the wire stem 530 is made to cover a terminal 512 as a contacting region on a semiconductor substrate 508 where the end 502a of the wire 502 is bonded, and the wire 502 of soft gold material is mounted and fixed to the terminal 512. By this setup, improvements can be made in an interconnection between microelectronic components.

WO/2008/020565	CONDUCTIVE CONTACTOR UNIT
JPS5887343	【考案の名称】ICテスタ-のテストプロ-バ-構造

KHANDROS IGOR Y (US)
MATHIEU GAETAN L (US)
ELDRIDGE BENJAMIN N (US)
GRUBE GARY W (US)

JP2000202978A

March 23, 2001

November 13, 1995

Click for automatic bibliography generation  

FORMFACTOR INC (US)

G01R1/073; B23K1/00; B23K20/00; B23K31/02; C23C18/16; C25D5/16; C25D7/12; G01R1/04; G01R1/06; G01R1/067; G01R31/26; G01R31/28; H01L21/00; H01L21/48; H01L21/56; H01L21/58; H01L21/60; H01L21/603; H01L21/607; H01L21/66; H01L21/68; H01L23/02; H01L23/12; H01L23/32; H01L23/48; H01L23/485; H01L23/49; H01L23/498; H01L23/538; H01L25/065; H01L25/07; H01L25/16; H01L25/18; H01R9/00; H01R12/16; H01R12/71; H01R13/05; H01R13/24; H01R29/00; H01R33/74; H01R33/76; H05H1/18; H05K1/18; H05K3/24; H05K3/30; H05K3/32; H05K3/40; H05K7/10; C25D5/08; C25D5/22; C25D21/02; H01R107/00; H05K1/14; H05K3/20; H05K3/34; H05K3/36; (IPC1-7): H01L23/32

Kaoru Furuya (2 outside)

Previous Patent: MOUNTING STRUCTURE SEMICODUCTOR PACKAGE

Next Patent: HEAT EXCHANGING ELEMENT