To cleanly remove machined chips on the surface to be removed by machining by stopping machining once in the midway of machining a workpiece and cover the surface including the machine removal area of the workpiece with a adhesive material.

An adhesive material supply means 8 pours an adhesive material 9 on the surface of a workpiece 2 including its machine removal area 3. The adhesive material 9 spreads out to the surface of the machine removal area 3 and simultaneously attracts machined chips stuck to the surface of the machine removal area 3. Thereafter, an adhesive material removal means 10 removes the adhesive material 9. Thus the surface of the machine removal area 3 is cleanly removed of the machined chips. There is, for example, a room temperature setting type double-fluid low precision silicon available for the adhesive material 9, therefore, as for the supply means 8, a foam body can be formed by using a double-liquid mixed spray gun.