To provide an electric part mounting method of electrically connecting and fixing an electric part to a printed wiring board, the mounting solder used for the same, and especially a means capable of soldering a jack which is required to have more fixing strength and a more amount of solder than a resistor or a capacitor at the same time when electric parts such as the resistors or the capacitors are soldered in a reflow soldering process where cream solder is used.

A jack 9 is required to have more fixing strength and a more amount of solder than a resistor 7 or a capacitor 6, a solidified solder lump 11 is placed for the jack 9 on a cream solder layer 5 of the same thickness with another cream solder layer 5 used for soldering the resistor 7 or the capacitor 6, and the solidified solder lump 11 and the cream solder layer 5 are melt by heating to solder the jack 9 to a solder land.