Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ELECTRIC PLATING METHOD FOR WIRING PATTERNS, SUCH AS TAPE CARRIER
Document Type and Number:
Japanese Patent JPH077047
Kind Code:
A
Abstract:

PURPOSE: To facilitate electric plating and reduce the cost of FPC or a tape carrier by plating electrically all wirings of a wiring pattern installed on a tape carrier and FPC or the like with a jig which makes an electric connection.

CONSTITUTION: A material of a tape carrier 5 is carried to a plating tank where a jig 1 places each wiring in an electrically connected state in the plating tank and connected to a lead wire 7 and solder-plated. In the case when the wirings on the tape carrier 5 in this device are independent and not connected to each other, it is possible to carry out electric plating by using the jig 1. The jig 1 consists of three sections, namely, a reinforcing part 6 which supports other parts, and the connection part 7 which connects wiring electrically in contact with a wiring 2 and a lead part 8 which supplies electricity to the wiring 2 by way of the connection part 7. This construction makes it possible to manufacture FPC and tape carriers at low cost.


Inventors:
CHIBA TSUKASA
Application Number:
JP14662093A
Publication Date:
January 10, 1995
Filing Date:
June 18, 1993
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HITACHI CABLE
International Classes:
C23C18/16; H01L21/60; H05K3/24; (IPC1-7): H01L21/60; C23C18/16
Attorney, Agent or Firm:
Takashi Matsumoto