Title:
ELECTRIC STRUCTURE AND FORMATION METHOD FOR IT
Document Type and Number:
Japanese Patent JP3418972
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To allow easy re-working by jointing a second conductor to an uncoated surface of a first conductor mechanically and electrically, and jointing the second conductor to a second substrate mechanically and electrically.
SOLUTION: Two pads 16 are provided on a surface 13 of a first substrate 12, and a first conductor 14 is formed on each of the pads 16. The first conductor 14 and an upper surface 13 are washed and roughened in a plasma processing, and the first conductor 14 and the upper surface 13 are coated with a material 18 such as photo-sensitized resin. The material 18 is irradiated with the light of appropriate wavelength using a photo-mask to form an uncoated surface 26. A second conductor 52 is mechanically and electrically connected to the surface 26 while the second conductor 52 is mechanically and electrically connected to a second substrate 42 through a pad 46, for easy re-working.
Inventors:
Miguel Angel Gelimares
Cynthia Susan Milkovich
Mark Vincent Pearson
Cynthia Susan Milkovich
Mark Vincent Pearson
Application Number:
JP2000131843A
Publication Date:
June 23, 2003
Filing Date:
April 28, 2000
Export Citation:
Assignee:
INTERNATIONAL BUSINESS MASCHINES CORPORATION
International Classes:
H01R12/04; B23K1/00; H01L21/48; H01L21/60; H01L23/485; H01L23/498; H01R4/02; H05K1/14; H05K3/00; H05K3/28; H05K3/34; H05K3/36; (IPC1-7): H05K1/14; H01L21/60; H05K3/00; H05K3/28; H05K3/34; H05K3/36
Domestic Patent References:
| JP10303245A | ||||
| JP10107081A | ||||
| JP6350250A | ||||
| JP661303A |
Attorney, Agent or Firm:
Hiroshi Sakaguchi (1 person outside)
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