Title:
WIRE PROCESSING DEVICE
Document Type and Number:
Japanese Patent JP2018060642
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a technology capable of crimping other terminal to a plurality of coated wires included in one cable with one time set.SOLUTION: A wire processing device 20 is a device for sending a plurality of coated wires of a cable 10 along a transportation pathway in a lump at a state that edge part is held, and treating the held edge part of the coated wire by a wire treatment part 60 aligned along the transportation pathway. The treatment process includes for example, a tip cut process for cutting tips of held edge part of the coated wire in order, a stripping process for stripping an insulation coating of the edge part of cut and aligned coated wire, and a crimping process for crimping a terminal to each core wire from which the stripped edge part is exposed. In the crimping process, a plurality of crimping mechanisms 71 are arranged to crimp other kind of terminal to a plurality of edge parts and a control part 120 selects the crimping mechanism 71 to use.SELECTED DRAWING: Figure 1
Inventors:
NAKAHIRA SHIGEJI
Application Number:
JP2016196278A
Publication Date:
April 12, 2018
Filing Date:
October 04, 2016
Export Citation:
Assignee:
SUMITOMO WIRING SYSTEMS
International Classes:
H01B13/00; H01B7/36; H01B13/34; H01R43/048
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita
Takahiro Arita
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