Title:
電気部品、および、電気回路の部分構造
Document Type and Number:
Japanese Patent JP5304883
Kind Code:
B2
Inventors:
Atsushi Tojo
Application Number:
JP2011502596A
Publication Date:
October 02, 2013
Filing Date:
December 15, 2009
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01P5/18
Foreign References:
| WO2010026906A1 | 2010-03-11 |
Other References:
JPN6013025297; 東條淳（ほか４名）: '「積層セラミックコンデンサの新しい共振モード 〜メタマテリアルへの応用〜」' 電子情報通信学会技術研究報告 Ｖｏｌ．１０８，Ｎｏ．３５０, 20081205, ｐｐ．１９-２４
JPN6013025300; Ｈｏａｎｇ Ｖａｎ Ｎｇｕｙｅｎ ｅｔ ａｌ．: '"Ｇｅｎｅｒａｌｉｚｅｄ Ｃｏｕｐｌｅｄ-Ｍｏｄｅ Ａｐｐｒｏａｃｈ ｏｆ Ｍｅｔａｍａｔｅｒｉａｌ Ｃｏｕｐｌｅｄ-Ｌｉｎｅ Ｃｏｕｐｌｅｒｓ：Ｃｏｕｐｌｉｎｇ Ｔｈｅｏｒｙ，Ｐｈｅｎｏｍｅｎｏｌｏ' ＩＥＥＥ Ｔｒａｎｓ． Ｍｉｃｒｏｗａｖｅ Ｔｈｅｏｒｙ ａｎｄ Ｔｅｃｈｎｉｑｕｅｓ Ｖｏｌ．５５，Ｎｏ．５, 200705, ｐｐ．１０２９-１０３９
JPN6013025300; Ｈｏａｎｇ Ｖａｎ Ｎｇｕｙｅｎ ｅｔ ａｌ．: '"Ｇｅｎｅｒａｌｉｚｅｄ Ｃｏｕｐｌｅｄ-Ｍｏｄｅ Ａｐｐｒｏａｃｈ ｏｆ Ｍｅｔａｍａｔｅｒｉａｌ Ｃｏｕｐｌｅｄ-Ｌｉｎｅ Ｃｏｕｐｌｅｒｓ：Ｃｏｕｐｌｉｎｇ Ｔｈｅｏｒｙ，Ｐｈｅｎｏｍｅｎｏｌｏ' ＩＥＥＥ Ｔｒａｎｓ． Ｍｉｃｒｏｗａｖｅ Ｔｈｅｏｒｙ ａｎｄ Ｔｅｃｈｎｉｑｕｅｓ Ｖｏｌ．５５，Ｎｏ．５, 200705, ｐｐ．１０２９-１０３９
Attorney, Agent or Firm:
Fukami patent office
Previous Patent: 車載情報処理装置及び情報処理方法
Next Patent: PRETREATMENT OF PICKLING MATERIAL AND APPARATUS THEREFOR
Next Patent: PRETREATMENT OF PICKLING MATERIAL AND APPARATUS THEREFOR