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Title:
ELECTRICAL CONDUCTIVE ADHESIVE
Document Type and Number:
Japanese Patent JPS6429467
Kind Code:
A
Abstract:

PURPOSE: To obtain the title adhesive excellent in an ability of bonding in high-speed bonding, moisture-resistance reliability and hydrolysis resistance, by mixing a specified modified resin with a ureido silane coupling agent and an electrical conductive powder.

CONSTITUTION: A modified resin (A) is obtained by reacting poly-p- hydroxystyrene (a) with an epoxy resin (b) (e.g., bisphenol diepoxide) in an amount approximately equivalent to component (a) by heating in the presence of, optionally, a catalyst. Component A is mixed with 100pts.wt. electrical conductive powder (B) (e.g., silver powder), 0.05W5pts.wt. ureido silane coupling agent (C) (e.g., γ-ureidoethyltrimethoxysilane) and, optionally, additives such as an antifoamer.


Inventors:
OKUNOYAMA TERU
KUBOTA YU
Application Number:
JP18351687A
Publication Date:
January 31, 1989
Filing Date:
July 24, 1987
Export Citation:
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Assignee:
TOSHIBA CHEM CORP
International Classes:
C08G59/14; C08G59/40; C09D163/00; C09J163/00; H01B1/20; H01B1/22; (IPC1-7): C09D3/58
Attorney, Agent or Firm:
Eiji Morota